1. 2. 3. material content data sheet sales product name ipb600n25n3 g issued 29. august 2013 ma# MA000678374 package pg-to263-3-2 weight* 1560.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.322 0.40 0.40 4050 4050 leadframe non noble metal iron 7439-89-6 0.304 0.02 195 inorganic material phosphorus 7723-14-0 0.091 0.01 59 non noble metal copper 7440-50-8 304.026 19.48 19.51 194769 195023 wire non noble metal aluminium 7429-90-5 6.480 0.42 0.42 4151 4151 encapsulation organic material carbon black 1333-86-4 10.208 0.65 6539 plastics epoxy resin - 112.285 7.19 71934 inorganic material silicondioxide 60676-86-0 558.024 35.74 43.58 357490 435964 leadfinish non noble metal tin 7440-31-5 9.657 0.62 0.62 6186 6186 plating non noble metal nickel 7440-02-0 0.228 0.01 146 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 146 solder noble metal silver 7440-22-4 0.124 0.01 79 non noble metal tin 7440-31-5 0.099 0.01 63 non noble metal lead 7439-92-1 4.728 0.30 0.32 3029 3171 heatspreader inorganic material phosphorus 7723-14-0 0.165 0.01 105 non noble metal iron 7439-89-6 0.548 0.04 351 non noble metal copper 7440-50-8 547.666 35.09 35.14 350853 351309 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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